Lextar Electronics will debut a package-free "white chip" LED technology that features substrate-free flip chip and phosphor molding process, and can be fabricated by current SMT equipment. The white chip is a chip scale die without packaging process, featuring high lumen densities, high lumen output, wide beam angle, and can be packaged closer therefore simplify optical lens design. Lextar's white chip can be applied to lighting products especially small-size lamps such as spot or candle lamps. It can also be applied to backlighting, helping reduce the thickness of direct-lit backlight modules, according to the company.
Lextar said when used in GU10 spot lamp, the white chip can achieve high lumen output and high lumen intensity, reaching up to 2500cd at 25 degrees with CRI 90 performance. The white chip also gives its point-light candle lamp identically glowing effects to the starlight to create an exquisite setting indoor.
"Since LED companies have been eager to attempt simplified manufacturing process at reduced costs in these few years, flip chip and several packaging-free LED products are getting more popular," said Reg Tsai, director of technology at the R&D division of Lextar.
Lextar said it expects to move the white chip into the market during second-quarter 2014.